A highly sensitive 3D-shaped tactile sensor

Kõiva R, Zenker M, Schürmann C, Haschke R, Ritter H (2013)
In: 2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics. Piscataway, NJ: IEEE: 1084-1089.

Konferenzbeitrag | Veröffentlicht | Englisch
 
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Abstract / Bemerkung
In this paper we introduce a novel way of producing highly sensitive 3D-shaped tactile sensors. The sense of touch is critical for enabling humans to master intricate manual interactions. Numerous anthropomorphic robots make extensive use of complex three dimensional body parts in mimicry of their biological counterparts. We use laser structuring technology to augment freeform surfaces with conductive tracks, paving the way for the manufacturing of 3D-shaped tactile sensors. The signal acquisition electronics can be effortlessly embedded on the backside of an artificial layer of skin. We evaluate the performance of the sensor and detailed results are presented. As an exciting application, we produced a tactile sensor for the distal phalanges of the Shadow Robot Hand that incorporates 12 tactile sensor regions and embedded signal acquisition electronics. The integrated microcontroller is able to capture force patterns with a frame-rate of more than 1 kHz, allowing object slippage to be detected.
Erscheinungsjahr
2013
Titel des Konferenzbandes
2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics
Seite(n)
1084-1089
Konferenz
IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM 2013)
Konferenzort
Wollongong, Australia
Konferenzdatum
2013-07-09 – 2013-07-12
ISBN
978-1-4673-5319-9
Page URI
https://pub.uni-bielefeld.de/record/2527560

Zitieren

Kõiva R, Zenker M, Schürmann C, Haschke R, Ritter H. A highly sensitive 3D-shaped tactile sensor. In: 2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics. Piscataway, NJ: IEEE; 2013: 1084-1089.
Kõiva, R., Zenker, M., Schürmann, C., Haschke, R., & Ritter, H. (2013). A highly sensitive 3D-shaped tactile sensor. 2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, 1084-1089. Piscataway, NJ: IEEE. doi:10.1109/AIM.2013.6584238
Kõiva, R., Zenker, M., Schürmann, C., Haschke, R., and Ritter, H. (2013). “A highly sensitive 3D-shaped tactile sensor” in 2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (Piscataway, NJ: IEEE), 1084-1089.
Kõiva, R., et al., 2013. A highly sensitive 3D-shaped tactile sensor. In 2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics. Piscataway, NJ: IEEE, pp. 1084-1089.
R. Kõiva, et al., “A highly sensitive 3D-shaped tactile sensor”, 2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, Piscataway, NJ: IEEE, 2013, pp.1084-1089.
Kõiva, R., Zenker, M., Schürmann, C., Haschke, R., Ritter, H.: A highly sensitive 3D-shaped tactile sensor. 2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics. p. 1084-1089. IEEE, Piscataway, NJ (2013).
Kõiva, Risto, Zenker, Matthias, Schürmann, Carsten, Haschke, Robert, and Ritter, Helge. “A highly sensitive 3D-shaped tactile sensor”. 2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics. Piscataway, NJ: IEEE, 2013. 1084-1089.
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Zuletzt Hochgeladen
2019-09-06T09:18:06Z
MD5 Prüfsumme
1201604aa0f93e8bfa3f7071200cf987

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