5 Publikationen

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  • [5]
    2023 | Konferenzbeitrag | Veröffentlicht | PUB-ID: 2983518
    Mika, K., Porrmann, F., Kucza, N., Griessl, R., & Hagemeyer, J. (2023). RECS: A Scalable Platform for Heterogeneous Computing. 2023 IEEE 36th International System-on-Chip Conference (SOCC), 1-6. IEEE. https://doi.org/10.1109/SOCC58585.2023.10256982
    PUB | DOI
     
  • [4]
    2023 | Konferenzbeitrag | Veröffentlicht | PUB-ID: 2982048
    Mika, K., Griessl, R., Kucza, N., Porrmann, F., Kaiser, M., Tigges, L., Hagemeyer, J., et al. (2023). VEDLIoT. Next generation accelerated AIoT systems and applications. CF '23: Proceedings of the 20th ACM International Conference on Computing Frontiers, 291-296. New York, NY: ACM. https://doi.org/10.1145/3587135.3592175
    PUB | DOI
     
  • [3]
    2023 | Konferenzbeitrag | Veröffentlicht | PUB-ID: 2979799
    Griessl, R., Porrmann, F., Kucza, N., Mika, K., Hagemeyer, J., Kaiser, M., Porrmann, M., et al. (2023). Evaluation of heterogeneous AIoT Accelerators within VEDLIoT. 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6. IEEE. https://doi.org/10.23919/DATE56975.2023.10137021
    PUB | DOI
     
  • [2]
    2022 | Konferenzbeitrag | Veröffentlicht | PUB-ID: 2964196
    Kaiser, M., Griessl, R., Kucza, N., Haumann, C., Tigges, L., Mika, K., Hagemeyer, J., et al. (2022). VEDLIoT: Very Efficient Deep Learning in IoT. In Institut of Electrical and Electronics Engineers (IEEE) (Ed.), DATE '22: Proceedings of the 2022 Conference & Exhibition on Design, Automation & Test in Europe (pp. 963-968). Leuven: European Design and Automation Association. https://doi.org/10.23919/DATE54114.2022.9774653
    PUB | DOI
     
  • [1]
    2020 | Konferenzbeitrag | Veröffentlicht | PUB-ID: 2982047
    Salami, B., Parasyris, K., Cristal, A., Unsal, O., Martorell, X., Carpenter, P., De La Cruz, R., et al. (2020). LEGaTO: Low-Energy, Secure, and Resilient Toolset for Heterogeneous Computing. 2020 Design, Automation & Test in Europe Conference & Exhibition (DATE), 169-174. Piscataway, NJ: IEEE. https://doi.org/10.23919/DATE48585.2020.9116362
    PUB | DOI
     

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