Modeling the Ultrasonic Softening Effect for Robust Copper Wire Bonding
Unger A, Sextro W, Althoff S, Meyer T, Neumann K, Reinhart F, Brökelmann M, Guth K, Bolowski D (2014)
In: 8th International Conference on Integrated Power Electronics Systems, Proceedings, February, 25-27, 2014 Nuremberg/Germany. ETG-Fachbericht, 141. VDE-Verlag.
Konferenzbeitrag
| Veröffentlicht | Englisch
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InCuB-CIPS2014-draft.pdf
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Autor*in
Unger, Andreas;
Sextro, Walter;
Althoff, Simon;
Meyer, Tobias;
Neumann, KlausUniBi;
Reinhart, FelixUniBi;
Brökelmann, Michael;
Guth, Karsten;
Bolowski, Daniel
Einrichtung
Abstract / Bemerkung
In power electronics, ultrasonic wire bonding is
used to connect the electrical terminals of power modules.
To implement a self-optimization technique for ultrasonic wire
bonding machines, a model of the process is essential. This
model needs to include the so called ultrasonic softening effect.
It is a key effect within the wire bonding process primarily
enabling the robust interconnection between the wire and a
substrate. However, the physical modeling of the ultrasonic
softening effect is notoriously difficult because of its highly
non-linear character and the absence of a proper measurement
method. In a first step, this paper validates the importance of
modeling the ultrasonic softening by showing its impact on the
wire deformation characteristic experimentally. In a second step,
the paper presents a data-driven model of the ultrasonic softening
effect which is constructed from data using machine learning
techniques. A typical caveat of data-driven modeling is the need
for training data that cover the considered domain of process
parameters in order to achieve accurate generalization of the
trained model to new process configurations. In practice, however,
the space of process parameters can only be sampled sparsely.
In this paper, a novel technique is applied which enables the
integration of prior knowledge about the process into the datadriven
modeling process. It turns out that this approach results in
accurate generalization of the data-driven model to novel process
parameters from sparse data.
Erscheinungsjahr
2014
Titel des Konferenzbandes
8th International Conference on Integrated Power Electronics Systems, Proceedings, February, 25-27, 2014 Nuremberg/Germany
Serien- oder Zeitschriftentitel
ETG-Fachbericht
Band
141
Konferenz
8th International Conference on Integrated Power Systems (CIPS)
Konferenzort
Nuremberg, Germany
Konferenzdatum
2014-02-25 – 2014-02-27
ISBN
978-3-8007-3578-5
Page URI
https://pub.uni-bielefeld.de/record/2900710
Zitieren
Unger A, Sextro W, Althoff S, et al. Modeling the Ultrasonic Softening Effect for Robust Copper Wire Bonding. In: 8th International Conference on Integrated Power Electronics Systems, Proceedings, February, 25-27, 2014 Nuremberg/Germany. ETG-Fachbericht. Vol 141. VDE-Verlag; 2014.
Unger, A., Sextro, W., Althoff, S., Meyer, T., Neumann, K., Reinhart, F., Brökelmann, M., et al. (2014). Modeling the Ultrasonic Softening Effect for Robust Copper Wire Bonding. 8th International Conference on Integrated Power Electronics Systems, Proceedings, February, 25-27, 2014 Nuremberg/Germany, ETG-Fachbericht, 141 VDE-Verlag.
Unger, Andreas, Sextro, Walter, Althoff, Simon, Meyer, Tobias, Neumann, Klaus, Reinhart, Felix, Brökelmann, Michael, Guth, Karsten, and Bolowski, Daniel. 2014. “Modeling the Ultrasonic Softening Effect for Robust Copper Wire Bonding”. In 8th International Conference on Integrated Power Electronics Systems, Proceedings, February, 25-27, 2014 Nuremberg/Germany. Vol. 141. ETG-Fachbericht. VDE-Verlag.
Unger, A., Sextro, W., Althoff, S., Meyer, T., Neumann, K., Reinhart, F., Brökelmann, M., Guth, K., and Bolowski, D. (2014). “Modeling the Ultrasonic Softening Effect for Robust Copper Wire Bonding” in 8th International Conference on Integrated Power Electronics Systems, Proceedings, February, 25-27, 2014 Nuremberg/Germany ETG-Fachbericht, vol. 141, (VDE-Verlag).
Unger, A., et al., 2014. Modeling the Ultrasonic Softening Effect for Robust Copper Wire Bonding. In 8th International Conference on Integrated Power Electronics Systems, Proceedings, February, 25-27, 2014 Nuremberg/Germany. ETG-Fachbericht. no.141 VDE-Verlag.
A. Unger, et al., “Modeling the Ultrasonic Softening Effect for Robust Copper Wire Bonding”, 8th International Conference on Integrated Power Electronics Systems, Proceedings, February, 25-27, 2014 Nuremberg/Germany, ETG-Fachbericht, vol. 141, VDE-Verlag, 2014.
Unger, A., Sextro, W., Althoff, S., Meyer, T., Neumann, K., Reinhart, F., Brökelmann, M., Guth, K., Bolowski, D.: Modeling the Ultrasonic Softening Effect for Robust Copper Wire Bonding. 8th International Conference on Integrated Power Electronics Systems, Proceedings, February, 25-27, 2014 Nuremberg/Germany. ETG-Fachbericht. 141, VDE-Verlag (2014).
Unger, Andreas, Sextro, Walter, Althoff, Simon, Meyer, Tobias, Neumann, Klaus, Reinhart, Felix, Brökelmann, Michael, Guth, Karsten, and Bolowski, Daniel. “Modeling the Ultrasonic Softening Effect for Robust Copper Wire Bonding”. 8th International Conference on Integrated Power Electronics Systems, Proceedings, February, 25-27, 2014 Nuremberg/Germany. VDE-Verlag, 2014.Vol. 141. ETG-Fachbericht.
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