2013 | Konferenzbeitrag | Veröffentlicht | PUB-ID: 2527560
R. Kõiva, et al., “A highly sensitive 3D-shaped tactile sensor”, 2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, Piscataway, NJ: IEEE, 2013, pp.1084-1089.
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