Geometric study of polymer embedded micro thermoelectric cooler with optimized contact resistance

Dutt AS, Deng K, Li G, Pulumati NB, Ramos DAL, Barati V, Garcia J, Perez N, Nielsch K, Schierning G, Reith H (2022)
Advanced Electronic Materials : 2101042.

Zeitschriftenaufsatz | E-Veröff. vor dem Druck | Englisch
 
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Autor*in
Dutt, Aditya S.; Deng, Kangfa; Li, Guodong; Pulumati, Nithin B.; Ramos, David Alberto Lara; Barati, Vida; Garcia, Javier; Perez, Nicolas; Nielsch, Kornelius; Schierning, GabiUniBi; Reith, Heiko
Abstract / Bemerkung
Micro-thermoelectric devices (mu TEDs) are used for bio-medical applications, powering internet-of-things devices, and thermal management. For such applications, mu TEDs need to have a robust packaging so that the devices can be brought in direct thermal contact with the target heat sink and source. The packaging technology developed for macroscopic modules needs improvement as it cannot be applied to mu TEDs due to a large thermal resistance between the capping material and the device which deteriorates its performance. In this work, mu TEDs with high net cooling temperature are fabricated by optimizing the contact resistance and device design combined with a novel packaging technique that is fully compatible with on-chip integration. The simulations and experiments demonstrate that the additional thermal loss caused by the packaging leads to an only marginal decrease in the net cooling temperature. The devices achieve a high net cooling temperature of 10.8 K without packaging and 9.6 K with packaging at room temperature. The packaging only slightly increases the thermal response time of the devices, which also shows an extremely high reliability of over 85 million cooling cycles. This simple packaging technique together with robust device performance is a step toward wide-spread application of mu TEDs.
Stichworte
contact resistance; electrochemical deposition; micro-thermoelectric; devices; packaging; TEC design; TEC reliability; thermoelectrics
Erscheinungsjahr
2022
Zeitschriftentitel
Advanced Electronic Materials
Art.-Nr.
2101042
eISSN
2199-160X
Page URI
https://pub.uni-bielefeld.de/record/2961641

Zitieren

Dutt AS, Deng K, Li G, et al. Geometric study of polymer embedded micro thermoelectric cooler with optimized contact resistance. Advanced Electronic Materials . 2022: 2101042.
Dutt, A. S., Deng, K., Li, G., Pulumati, N. B., Ramos, D. A. L., Barati, V., Garcia, J., et al. (2022). Geometric study of polymer embedded micro thermoelectric cooler with optimized contact resistance. Advanced Electronic Materials , 2101042. https://doi.org/10.1002/aelm.202101042
Dutt, A. S., Deng, K., Li, G., Pulumati, N. B., Ramos, D. A. L., Barati, V., Garcia, J., Perez, N., Nielsch, K., Schierning, G., et al. (2022). Geometric study of polymer embedded micro thermoelectric cooler with optimized contact resistance. Advanced Electronic Materials :2101042.
Dutt, A.S., et al., 2022. Geometric study of polymer embedded micro thermoelectric cooler with optimized contact resistance. Advanced Electronic Materials , : 2101042.
A.S. Dutt, et al., “Geometric study of polymer embedded micro thermoelectric cooler with optimized contact resistance”, Advanced Electronic Materials , 2022, : 2101042.
Dutt, A.S., Deng, K., Li, G., Pulumati, N.B., Ramos, D.A.L., Barati, V., Garcia, J., Perez, N., Nielsch, K., Schierning, G., Reith, H.: Geometric study of polymer embedded micro thermoelectric cooler with optimized contact resistance. Advanced Electronic Materials . : 2101042 (2022).
Dutt, Aditya S., Deng, Kangfa, Li, Guodong, Pulumati, Nithin B., Ramos, David Alberto Lara, Barati, Vida, Garcia, Javier, Perez, Nicolas, Nielsch, Kornelius, Schierning, Gabi, and Reith, Heiko. “Geometric study of polymer embedded micro thermoelectric cooler with optimized contact resistance”. Advanced Electronic Materials (2022): 2101042.

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