Formation of In-Cu pairs in silicon during chemomechanical polishing
Wichert T, Keller R, Deicher M, Pfeiffer W, Skudlik H, Steiner D (1990) .
Konferenzbeitrag
| Veröffentlicht | Englisch
Download
Es wurden keine Dateien hochgeladen. Nur Publikationsnachweis!
Autor*in
Wichert, Th.;
Keller, R.;
Deicher, M.;
Pfeiffer, WalterUniBi;
Skudlik, H.;
Steiner, D.
Erscheinungsjahr
1990
Band
163
Seite(n)
245
Page URI
https://pub.uni-bielefeld.de/record/2316217
Zitieren
Wichert T, Keller R, Deicher M, Pfeiffer W, Skudlik H, Steiner D. Formation of In-Cu pairs in silicon during chemomechanical polishing.
Wichert, T., Keller, R., Deicher, M., Pfeiffer, W., Skudlik, H., & Steiner, D. (1990). Formation of In-Cu pairs in silicon during chemomechanical polishing. Presented at the
Wichert, Th., Keller, R., Deicher, M., Pfeiffer, Walter, Skudlik, H., and Steiner, D. 1990. “Formation of In-Cu pairs in silicon during chemomechanical polishing”. Presented at the , 163:245. Mat. Res. Soc. Symp. Proc.
Wichert, T., Keller, R., Deicher, M., Pfeiffer, W., Skudlik, H., and Steiner, D. (1990).“Formation of In-Cu pairs in silicon during chemomechanical polishing”.
Wichert, T., et al., 1990. Formation of In-Cu pairs in silicon during chemomechanical polishing.
T. Wichert, et al., “Formation of In-Cu pairs in silicon during chemomechanical polishing”, Mat. Res. Soc. Symp. Proc., 1990.
Wichert, T., Keller, R., Deicher, M., Pfeiffer, W., Skudlik, H., Steiner, D.: Formation of In-Cu pairs in silicon during chemomechanical polishing. (1990).
Wichert, Th., Keller, R., Deicher, M., Pfeiffer, Walter, Skudlik, H., and Steiner, D. “Formation of In-Cu pairs in silicon during chemomechanical polishing”., Mat. Res. Soc. Symp. Proc., 1990.
Google Scholar