STM writing of artificial nanostructures in ultrathin PMMA and SAM resists and subsequent pattern transfer in a Mo/Si multilayer by reactive ion etching

Hartwich J, Dreeskornfeld L, Heisig V, Rahn S, Wehmeyer O, Kleineberg U, Heinzmann U (1998)
In: Applied Physics A: Materials Science & Processing. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 66(7). SPRINGER VERLAG: S685-S688.

Konferenzbeitrag | Veröffentlicht | Englisch
 
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Autor*in
Hartwich, J; Dreeskornfeld, L; Heisig, V; Rahn, S; Wehmeyer, O; Kleineberg, U; Heinzmann, UlrichUniBi
Abstract / Bemerkung
We report on the fabrication of artificial nanostructures in ultrathin resist films patterned by STM lithography in ultrahigh vacuum ambience. Two different types of resists, polymethylmethacrylate (PMMA) and alkanethiol-type self-assembled monolayer (SAM), have been patterned by an UHV-STM. The PMMA patterns were analyzed by atomic force microscopy (AFM); the SAM patterns were investigated by STM. Lines widths down to 75 nm were reproducibly achieved in PMMA with bias voltages up to 10 V and tip currents of 1 nA. Carbon build-up due to contamination writing and resist removal was observed with the STM patterning the SAM. The PMMA pattern was successfully transferred into the underlying Mo/Si multilayer substrate by fluorine reactive ion etching (RTE), showing STM lithography as an attractive alternative to conventional e-beam lithography for the fabrication of lateral nanostructures in multilayers.
Erscheinungsjahr
1998
Titel des Konferenzbandes
Applied Physics A: Materials Science & Processing
Band
66
Ausgabe
7
Seite(n)
S685-S688
ISSN
0947-8396
Page URI
https://pub.uni-bielefeld.de/record/1624512

Zitieren

Hartwich J, Dreeskornfeld L, Heisig V, et al. STM writing of artificial nanostructures in ultrathin PMMA and SAM resists and subsequent pattern transfer in a Mo/Si multilayer by reactive ion etching. In: Applied Physics A: Materials Science & Processing. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING. Vol 66. SPRINGER VERLAG; 1998: S685-S688.
Hartwich, J., Dreeskornfeld, L., Heisig, V., Rahn, S., Wehmeyer, O., Kleineberg, U., & Heinzmann, U. (1998). STM writing of artificial nanostructures in ultrathin PMMA and SAM resists and subsequent pattern transfer in a Mo/Si multilayer by reactive ion etching. Applied Physics A: Materials Science & Processing, APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 66, S685-S688. SPRINGER VERLAG. doi:10.1007/s003390051222
Hartwich, J., Dreeskornfeld, L., Heisig, V., Rahn, S., Wehmeyer, O., Kleineberg, U., and Heinzmann, U. (1998). “STM writing of artificial nanostructures in ultrathin PMMA and SAM resists and subsequent pattern transfer in a Mo/Si multilayer by reactive ion etching” in Applied Physics A: Materials Science & Processing APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, vol. 66, (SPRINGER VERLAG), S685-S688.
Hartwich, J., et al., 1998. STM writing of artificial nanostructures in ultrathin PMMA and SAM resists and subsequent pattern transfer in a Mo/Si multilayer by reactive ion etching. In Applied Physics A: Materials Science & Processing. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING. no.66 SPRINGER VERLAG, pp. S685-S688.
J. Hartwich, et al., “STM writing of artificial nanostructures in ultrathin PMMA and SAM resists and subsequent pattern transfer in a Mo/Si multilayer by reactive ion etching”, Applied Physics A: Materials Science & Processing, APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, vol. 66, SPRINGER VERLAG, 1998, pp.S685-S688.
Hartwich, J., Dreeskornfeld, L., Heisig, V., Rahn, S., Wehmeyer, O., Kleineberg, U., Heinzmann, U.: STM writing of artificial nanostructures in ultrathin PMMA and SAM resists and subsequent pattern transfer in a Mo/Si multilayer by reactive ion etching. Applied Physics A: Materials Science & Processing. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING. 66, p. S685-S688. SPRINGER VERLAG (1998).
Hartwich, J, Dreeskornfeld, L, Heisig, V, Rahn, S, Wehmeyer, O, Kleineberg, U, and Heinzmann, Ulrich. “STM writing of artificial nanostructures in ultrathin PMMA and SAM resists and subsequent pattern transfer in a Mo/Si multilayer by reactive ion etching”. Applied Physics A: Materials Science & Processing. SPRINGER VERLAG, 1998.Vol. 66. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING. S685-S688.

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