Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers

Heitmann S, Hütten A, Hempel T, Schepper W, Reiss G, Alof C (2000)
In: Journal of Applied Physics. JOURNAL OF APPLIED PHYSICS, 87(9). AMER INST PHYSICS: 4849-4851.

Konferenzbeitrag | Veröffentlicht | Englisch
 
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Abstract / Bemerkung
The evolution of the giant magnetoresistance (GMR) effect in sputtered combination multilayers (CMLs) of type Py-1.8nm//{(Cu-1.8nm/Py-1.6nm)(N)/(Cu-0.9nm/Py-1.6nm)(N)}(y) with Py (permalloy=Ni81Fe19) has been investigated at room temperature. It is shown that the GMR characteristic of these CMLs can be phenomenologically predicted, if the physical properties are known, i.e., the GMR effect amplitude, double layer conductance, and bilinear and biquadratic antiferromagnetic exchange coupling constants of the two underlying {Cu/Py}(N) base systems at the first (Cu-0.9nm) and second (Cu-1.8nm) antiferromagnetic coupling maximum (AFCM). The GMR characteristic of the simplest CML with N = 1 is, e.g., determined by averaging the bilinear and biqua dratic exchange coupling constants of the two base systems. The GMR characteristics of CML with N greater than or equal to 2 are a superposition of that of the underlying {Cu/Py}(N) base systems weighted by the fraction of the corresponding double layer conductance. Furthermore, it is demonstrated that the CMLs are interesting from an application point of view since they combine the temperature stability of the underlying {Cu/Py}(N) base system at the second AFCM with a larger GMR effect amplitude. (C) 2000 American Institute of Physics. [S0021-8979(00)57908-0].
Erscheinungsjahr
2000
Titel des Konferenzbandes
Journal of Applied Physics
Band
87
Ausgabe
9
Seite(n)
4849-4851
ISSN
0021-8979
Page URI
https://pub.uni-bielefeld.de/record/1620053

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Heitmann S, Hütten A, Hempel T, Schepper W, Reiss G, Alof C. Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers. In: Journal of Applied Physics. JOURNAL OF APPLIED PHYSICS. Vol 87. AMER INST PHYSICS; 2000: 4849-4851.
Heitmann, S., Hütten, A., Hempel, T., Schepper, W., Reiss, G., & Alof, C. (2000). Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers. Journal of Applied Physics, JOURNAL OF APPLIED PHYSICS, 87, 4849-4851. AMER INST PHYSICS. doi:10.1063/1.373179
Heitmann, S., Hütten, A., Hempel, T., Schepper, W., Reiss, G., and Alof, C. (2000). “Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers” in Journal of Applied Physics JOURNAL OF APPLIED PHYSICS, vol. 87, (AMER INST PHYSICS), 4849-4851.
Heitmann, S., et al., 2000. Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers. In Journal of Applied Physics. JOURNAL OF APPLIED PHYSICS. no.87 AMER INST PHYSICS, pp. 4849-4851.
S. Heitmann, et al., “Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers”, Journal of Applied Physics, JOURNAL OF APPLIED PHYSICS, vol. 87, AMER INST PHYSICS, 2000, pp.4849-4851.
Heitmann, S., Hütten, A., Hempel, T., Schepper, W., Reiss, G., Alof, C.: Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers. Journal of Applied Physics. JOURNAL OF APPLIED PHYSICS. 87, p. 4849-4851. AMER INST PHYSICS (2000).
Heitmann, S, Hütten, Andreas, Hempel, T, Schepper, Willi, Reiss, Günter, and Alof, C. “Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers”. Journal of Applied Physics. AMER INST PHYSICS, 2000.Vol. 87. JOURNAL OF APPLIED PHYSICS. 4849-4851.