Thermal reaction and stability of NiFe/Cu thin films investigated by atom probe tomography

Ene CB, Schmitz G, Kirchheim R, Hütten A (2007)
In: Surface and Interface Analysis. SURFACE AND INTERFACE ANALYSIS, 39(2-3). JOHN WILEY & SONS LTD: 227-231.

Konferenzbeitrag | Veröffentlicht | Englisch
 
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Autor*in
Ene, C. B.; Schmitz, G.; Kirchheim, R.; Hütten, AndreasUniBi
Abstract / Bemerkung
NiFe/Cu multilayer stacks of 2 nm single layer thickness were deposited onto needle-shaped W tips by ion beam sputtering and analysed by atom probe tomography (TAP) after appropriate heat treatments. After annealing at 250 degrees C for 30 min, no significant structural or chemical transformation of the initial layer system is detected, although such a heat treatment appreciably reduces the magneto resistivity. A slight decrease of the concentration slope at the interfaces is attributed to a very short-range interdiffusion. Clear grain boundary diffusion is observed after annealing at 400 degrees C for 30 min. Further annealing at 500 degrees C for 20 min and 40 min still preserves the layered structure with a homogeneous solution of Ni inside the Cu layers of up to 25 at.% Ni. Copyright (C) 2007 John Wiley & Sons, Ltd.
Stichworte
thin films; atom probe tomography; field ion microscopy; GMR
Erscheinungsjahr
2007
Titel des Konferenzbandes
Surface and Interface Analysis
Band
39
Ausgabe
2-3
Seite(n)
227-231
ISSN
0142-2421
Page URI
https://pub.uni-bielefeld.de/record/1595750

Zitieren

Ene CB, Schmitz G, Kirchheim R, Hütten A. Thermal reaction and stability of NiFe/Cu thin films investigated by atom probe tomography. In: Surface and Interface Analysis. SURFACE AND INTERFACE ANALYSIS. Vol 39. JOHN WILEY & SONS LTD; 2007: 227-231.
Ene, C. B., Schmitz, G., Kirchheim, R., & Hütten, A. (2007). Thermal reaction and stability of NiFe/Cu thin films investigated by atom probe tomography. Surface and Interface Analysis, SURFACE AND INTERFACE ANALYSIS, 39, 227-231. JOHN WILEY & SONS LTD. doi:10.1002/sia.2519
Ene, C. B., Schmitz, G., Kirchheim, R., and Hütten, A. (2007). “Thermal reaction and stability of NiFe/Cu thin films investigated by atom probe tomography” in Surface and Interface Analysis SURFACE AND INTERFACE ANALYSIS, vol. 39, (JOHN WILEY & SONS LTD), 227-231.
Ene, C.B., et al., 2007. Thermal reaction and stability of NiFe/Cu thin films investigated by atom probe tomography. In Surface and Interface Analysis. SURFACE AND INTERFACE ANALYSIS. no.39 JOHN WILEY & SONS LTD, pp. 227-231.
C.B. Ene, et al., “Thermal reaction and stability of NiFe/Cu thin films investigated by atom probe tomography”, Surface and Interface Analysis, SURFACE AND INTERFACE ANALYSIS, vol. 39, JOHN WILEY & SONS LTD, 2007, pp.227-231.
Ene, C.B., Schmitz, G., Kirchheim, R., Hütten, A.: Thermal reaction and stability of NiFe/Cu thin films investigated by atom probe tomography. Surface and Interface Analysis. SURFACE AND INTERFACE ANALYSIS. 39, p. 227-231. JOHN WILEY & SONS LTD (2007).
Ene, C. B., Schmitz, G., Kirchheim, R., and Hütten, Andreas. “Thermal reaction and stability of NiFe/Cu thin films investigated by atom probe tomography”. Surface and Interface Analysis. JOHN WILEY & SONS LTD, 2007.Vol. 39. SURFACE AND INTERFACE ANALYSIS. 227-231.

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