Exposure of monomolecular resists with low energy electrons

Kirk ECG, Mertig M, Monch I, Bertram M, Schumann J, vanLoyen L, Gladun A, Reiss G (1995)
Nanostructured Materials 6(5-8): 703-706.

Journal Article | Published | English

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Abstract
Monomolecular resist films of tricosenoic and tricosenoic acid as well as polymethylmethacrylate (PMMA), prepared on thin Au and PT films by the Langmuir-Blodgett (LB) technique have been exposed by electron-beams with an energy down to 2 keV. Below 5 keV, PMMA was found to act either as positive or negative resist depending on the dose. Ultra low voltage beam (less than or equal to 10 V) experiments with the scanning tunnelling microscope (STM) have not yet resulted in polymerization of the films. Pattern transfer into the Au films by wet or Ar ion etching has been demonstrated.
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Kirk ECG, Mertig M, Monch I, et al. Exposure of monomolecular resists with low energy electrons. Nanostructured Materials. 1995;6(5-8):703-706.
Kirk, E. C. G., Mertig, M., Monch, I., Bertram, M., Schumann, J., vanLoyen, L., Gladun, A., et al. (1995). Exposure of monomolecular resists with low energy electrons. Nanostructured Materials, 6(5-8), 703-706.
Kirk, E. C. G., Mertig, M., Monch, I., Bertram, M., Schumann, J., vanLoyen, L., Gladun, A., and Reiss, G. (1995). Exposure of monomolecular resists with low energy electrons. Nanostructured Materials 6, 703-706.
Kirk, E.C.G., et al., 1995. Exposure of monomolecular resists with low energy electrons. Nanostructured Materials, 6(5-8), p 703-706.
E.C.G. Kirk, et al., “Exposure of monomolecular resists with low energy electrons”, Nanostructured Materials, vol. 6, 1995, pp. 703-706.
Kirk, E.C.G., Mertig, M., Monch, I., Bertram, M., Schumann, J., vanLoyen, L., Gladun, A., Reiss, G.: Exposure of monomolecular resists with low energy electrons. Nanostructured Materials. 6, 703-706 (1995).
Kirk, ECG, Mertig, M, Monch, I, Bertram, M, Schumann, J, vanLoyen, L, Gladun, A, and Reiss, Günter. “Exposure of monomolecular resists with low energy electrons”. Nanostructured Materials 6.5-8 (1995): 703-706.
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