Intermodulation and quality factor of high-T-c superconducting microstrip structures

Dahm T, Scalapino DJ (1997)
Journal of Applied Physics 82(1): 464-468.

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Zeitschriftenaufsatz | Veröffentlicht | Englisch
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Abstract / Bemerkung
The intermodulation power and quality factor Q of high-T-c superconducting microstrip resonators with different shapes is calculated. Acute corners increase the losses and the intermodulation power. The influence of normal conducting regions is investigated. The case of two microstrips carrying in phase or out of phase currents is also studied. The losses and the intermodulation power are significantly reduced if the currents are in phase in the two microstrips compared to the mode with out of phase currents. (C) 1997 American Institute of Physics.
Erscheinungsjahr
Zeitschriftentitel
Journal of Applied Physics
Band
82
Zeitschriftennummer
1
Seite
464-468
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Dahm T, Scalapino DJ. Intermodulation and quality factor of high-T-c superconducting microstrip structures. Journal of Applied Physics. 1997;82(1):464-468.
Dahm, T., & Scalapino, D. J. (1997). Intermodulation and quality factor of high-T-c superconducting microstrip structures. Journal of Applied Physics, 82(1), 464-468. doi:10.1063/1.365839
Dahm, T., and Scalapino, D. J. (1997). Intermodulation and quality factor of high-T-c superconducting microstrip structures. Journal of Applied Physics 82, 464-468.
Dahm, T., & Scalapino, D.J., 1997. Intermodulation and quality factor of high-T-c superconducting microstrip structures. Journal of Applied Physics, 82(1), p 464-468.
T. Dahm and D.J. Scalapino, “Intermodulation and quality factor of high-T-c superconducting microstrip structures”, Journal of Applied Physics, vol. 82, 1997, pp. 464-468.
Dahm, T., Scalapino, D.J.: Intermodulation and quality factor of high-T-c superconducting microstrip structures. Journal of Applied Physics. 82, 464-468 (1997).
Dahm, Thomas, and Scalapino, DJ. “Intermodulation and quality factor of high-T-c superconducting microstrip structures”. Journal of Applied Physics 82.1 (1997): 464-468.