Formation of In-Cu pairs in silicon during chemomechanical polishing

Wichert T, Keller R, Deicher M, Pfeiffer W, Skudlik H, Steiner D (1990) .

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Wichert T, Keller R, Deicher M, Pfeiffer W, Skudlik H, Steiner D. Formation of In-Cu pairs in silicon during chemomechanical polishing.
Wichert, T., Keller, R., Deicher, M., Pfeiffer, W., Skudlik, H., & Steiner, D. (1990). Formation of In-Cu pairs in silicon during chemomechanical polishing. Presented at the .
Wichert, T., Keller, R., Deicher, M., Pfeiffer, W., Skudlik, H., and Steiner, D. (1990).“Formation of In-Cu pairs in silicon during chemomechanical polishing”.
Wichert, T., et al., 1990. Formation of In-Cu pairs in silicon during chemomechanical polishing.
T. Wichert, et al., “Formation of In-Cu pairs in silicon during chemomechanical polishing”, Mat. Res. Soc. Symp. Proc., 1990.
Wichert, T., Keller, R., Deicher, M., Pfeiffer, W., Skudlik, H., Steiner, D.: Formation of In-Cu pairs in silicon during chemomechanical polishing. (1990).
Wichert, Th., Keller, R., Deicher, M., Pfeiffer, Walter, Skudlik, H., and Steiner, D. “Formation of In-Cu pairs in silicon during chemomechanical polishing”., Mat. Res. Soc. Symp. Proc., 1990.
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