High level estimation of the area and power consumption of on-chip interconnects

Langen D, Brinkmann A, Rückert U (2000)
In: ASIC/SOC Conference, 2000. Proceedings. 13th Annual IEEE International. 297-301.

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This paper addresses the problem of estimating the power and area consumption of on-chip interconnects for standard cell ASIC processes. We introduce a set of analytic investigations on buses, crossbar switches, and multiplexors. Furthermore we prove the accuracy of the results by comparing them with gate-level powerestimations on a double metal 0.6μm CMOS technology.
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Langen D, Brinkmann A, Rückert U. High level estimation of the area and power consumption of on-chip interconnects. In: ASIC/SOC Conference, 2000. Proceedings. 13th Annual IEEE International. 2000: 297-301.
Langen, D., Brinkmann, A., & Rückert, U. (2000). High level estimation of the area and power consumption of on-chip interconnects. ASIC/SOC Conference, 2000. Proceedings. 13th Annual IEEE International, 297-301.
Langen, D., Brinkmann, A., and Rückert, U. (2000). “High level estimation of the area and power consumption of on-chip interconnects” in ASIC/SOC Conference, 2000. Proceedings. 13th Annual IEEE International 297-301.
Langen, D., Brinkmann, A., & Rückert, U., 2000. High level estimation of the area and power consumption of on-chip interconnects. In ASIC/SOC Conference, 2000. Proceedings. 13th Annual IEEE International. pp. 297-301.
D. Langen, A. Brinkmann, and U. Rückert, “High level estimation of the area and power consumption of on-chip interconnects”, ASIC/SOC Conference, 2000. Proceedings. 13th Annual IEEE International, 2000, pp.297-301.
Langen, D., Brinkmann, A., Rückert, U.: High level estimation of the area and power consumption of on-chip interconnects. ASIC/SOC Conference, 2000. Proceedings. 13th Annual IEEE International. p. 297-301. (2000).
Langen, D., Brinkmann, A., and Rückert, Ulrich. “High level estimation of the area and power consumption of on-chip interconnects”. ASIC/SOC Conference, 2000. Proceedings. 13th Annual IEEE International. 2000. 297-301.
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