Modular tacTiles for Sonic Interactions with Smart Environments

Anlauff J, Hermann T, Großhauser T, Cooperstock J (2009)
In: Proceedings of the 4th International Conference on Haptic and Audio Design / Lecture Notes on Computer Science, Volume 5763. Altinoy E, Jekosch U, Brewster S (Eds);2. Berlin, Heidelberg: Springer: 26-27.

Conference Paper | Published | English

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Editor
Altinoy, Ercan ; Jekosch, Ute ; Brewster, Stephen
Abstract
In this paper, we present a prototype of a spatially resolved force sensing floor surface. The force sensors are based on conductive paper and grouped into modules called tacTiles. Due to the cheap and widely available materials used for tacTiles, the approach is suitable as a low-cost alternative for spatially resolved tactile sensing. The necessary techniques are shared as an open source and open hardware project to provide an affordable tactile sensing for smart environments. As an interactive application of these tacTiles, we present a detection of step direction algorithm used to count steps into and out of a room.
Publishing Year
Conference
Haptic and Audio Interaction Design (HAID '09)
Location
Dresden, Germany
Conference Date
2009-09-10/2009-09-11
ISSN
PUB-ID

Cite this

Anlauff J, Hermann T, Großhauser T, Cooperstock J. Modular tacTiles for Sonic Interactions with Smart Environments. In: Altinoy E, Jekosch U, Brewster S, eds. Proceedings of the 4th International Conference on Haptic and Audio Design / Lecture Notes on Computer Science, Volume 5763. Vol 2. Berlin, Heidelberg: Springer; 2009: 26-27.
Anlauff, J., Hermann, T., Großhauser, T., & Cooperstock, J. (2009). Modular tacTiles for Sonic Interactions with Smart Environments. In E. Altinoy, U. Jekosch, & S. Brewster (Eds.), Proceedings of the 4th International Conference on Haptic and Audio Design / Lecture Notes on Computer Science, Volume 5763 (Vol. 2, pp. 26-27). Berlin, Heidelberg: Springer.
Anlauff, J., Hermann, T., Großhauser, T., and Cooperstock, J. (2009). “Modular tacTiles for Sonic Interactions with Smart Environments” in Proceedings of the 4th International Conference on Haptic and Audio Design / Lecture Notes on Computer Science, Volume 5763, ed. E. Altinoy, U. Jekosch, and S. Brewster, vol. 2, (Berlin, Heidelberg: Springer), 26-27.
Anlauff, J., et al., 2009. Modular tacTiles for Sonic Interactions with Smart Environments. In E. Altinoy, U. Jekosch, & S. Brewster, eds. Proceedings of the 4th International Conference on Haptic and Audio Design / Lecture Notes on Computer Science, Volume 5763. no.2 Berlin, Heidelberg: Springer, pp. 26-27.
J. Anlauff, et al., “Modular tacTiles for Sonic Interactions with Smart Environments”, Proceedings of the 4th International Conference on Haptic and Audio Design / Lecture Notes on Computer Science, Volume 5763, E. Altinoy, U. Jekosch, and S. Brewster, eds., vol. 2, Berlin, Heidelberg: Springer, 2009, pp.26-27.
Anlauff, J., Hermann, T., Großhauser, T., Cooperstock, J.: Modular tacTiles for Sonic Interactions with Smart Environments. In: Altinoy, E., Jekosch, U., and Brewster, S. (eds.) Proceedings of the 4th International Conference on Haptic and Audio Design / Lecture Notes on Computer Science, Volume 5763. 2, p. 26-27. Springer, Berlin, Heidelberg (2009).
Anlauff, Jan, Hermann, Thomas, Großhauser, Tobias, and Cooperstock, Jeremy. “Modular tacTiles for Sonic Interactions with Smart Environments”. Proceedings of the 4th International Conference on Haptic and Audio Design / Lecture Notes on Computer Science, Volume 5763. Ed. Ercan Altinoy, Ute Jekosch, and Stephen Brewster. Berlin, Heidelberg: Springer, 2009.Vol. 2. 26-27.
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