Towards a Computational Model of Acoustic Packaging

Schillingmann L, Wrede B, Rohlfing K (2009)
In: International Conference on Development and Learning (ICDL 2009). IEEE.

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Conference Paper | Published | English
Publishing Year
Conference
8th International Conference on Development and Learning
Location
Shanghai, China
Conference Date
2009-06-05 – 2009-06-07
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Schillingmann L, Wrede B, Rohlfing K. Towards a Computational Model of Acoustic Packaging. In: International Conference on Development and Learning (ICDL 2009). IEEE; 2009.
Schillingmann, L., Wrede, B., & Rohlfing, K. (2009). Towards a Computational Model of Acoustic Packaging. International Conference on Development and Learning (ICDL 2009).
Schillingmann, L., Wrede, B., and Rohlfing, K. (2009). “Towards a Computational Model of Acoustic Packaging” in International Conference on Development and Learning (ICDL 2009) (IEEE).
Schillingmann, L., Wrede, B., & Rohlfing, K., 2009. Towards a Computational Model of Acoustic Packaging. In International Conference on Development and Learning (ICDL 2009). IEEE.
L. Schillingmann, B. Wrede, and K. Rohlfing, “Towards a Computational Model of Acoustic Packaging”, International Conference on Development and Learning (ICDL 2009), IEEE, 2009.
Schillingmann, L., Wrede, B., Rohlfing, K.: Towards a Computational Model of Acoustic Packaging. International Conference on Development and Learning (ICDL 2009). IEEE (2009).
Schillingmann, Lars, Wrede, Britta, and Rohlfing, Katharina. “Towards a Computational Model of Acoustic Packaging”. International Conference on Development and Learning (ICDL 2009). IEEE, 2009.
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