Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers

Heitmann S, Hütten A, Hempel T, Schepper W, Reiss G, Alof C (2000)
JOURNAL OF APPLIED PHYSICS 87(9): 4849-4851.

Download
Es wurde kein Volltext hochgeladen. Nur Publikationsnachweis!
Konferenzbeitrag | Veröffentlicht | Englisch
Autor
Abstract / Bemerkung
The evolution of the giant magnetoresistance (GMR) effect in sputtered combination multilayers (CMLs) of type Py-1.8nm//{(Cu-1.8nm/Py-1.6nm)(N)/(Cu-0.9nm/Py-1.6nm)(N)}(y) with Py (permalloy=Ni81Fe19) has been investigated at room temperature. It is shown that the GMR characteristic of these CMLs can be phenomenologically predicted, if the physical properties are known, i.e., the GMR effect amplitude, double layer conductance, and bilinear and biquadratic antiferromagnetic exchange coupling constants of the two underlying {Cu/Py}(N) base systems at the first (Cu-0.9nm) and second (Cu-1.8nm) antiferromagnetic coupling maximum (AFCM). The GMR characteristic of the simplest CML with N = 1 is, e.g., determined by averaging the bilinear and biqua dratic exchange coupling constants of the two base systems. The GMR characteristics of CML with N greater than or equal to 2 are a superposition of that of the underlying {Cu/Py}(N) base systems weighted by the fraction of the corresponding double layer conductance. Furthermore, it is demonstrated that the CMLs are interesting from an application point of view since they combine the temperature stability of the underlying {Cu/Py}(N) base system at the second AFCM with a larger GMR effect amplitude. (C) 2000 American Institute of Physics. [S0021-8979(00)57908-0].
Erscheinungsjahr
Band
87
Zeitschriftennummer
9
Seite
4849-4851
ISSN
PUB-ID

Zitieren

Heitmann S, Hütten A, Hempel T, Schepper W, Reiss G, Alof C. Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers. JOURNAL OF APPLIED PHYSICS. 2000;87(9):4849-4851.
Heitmann, S., Hütten, A., Hempel, T., Schepper, W., Reiss, G., & Alof, C. (2000). Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers. JOURNAL OF APPLIED PHYSICS, 87(9), 4849-4851. doi:10.1063/1.373179
Heitmann, S., Hütten, A., Hempel, T., Schepper, W., Reiss, G., and Alof, C. (2000). Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers. JOURNAL OF APPLIED PHYSICS 87, 4849-4851.
Heitmann, S., et al., 2000. Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers. JOURNAL OF APPLIED PHYSICS, 87(9), p 4849-4851.
S. Heitmann, et al., “Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers”, JOURNAL OF APPLIED PHYSICS, vol. 87, 2000, pp. 4849-4851.
Heitmann, S., Hütten, A., Hempel, T., Schepper, W., Reiss, G., Alof, C.: Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers. JOURNAL OF APPLIED PHYSICS. 87, 4849-4851 (2000).
Heitmann, S, Hütten, Andreas, Hempel, T, Schepper, Willi, Reiss, Günter, and Alof, C. “Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers”. JOURNAL OF APPLIED PHYSICS 87.9 (2000): 4849-4851.