Neel's magnetostatic coupling in sputtered Cu/Py/V/Py/MnIr/Cu multilayers

Urbaniak M, Brückl H, Stobiecki F, Lucinski T, Reiss G (2004)
ACTA PHYSICA POLONICA A 105(3): 307-313.

Download
Es wurde kein Volltext hochgeladen. Nur Publikationsnachweis!
Zeitschriftenaufsatz | Veröffentlicht | Englisch
Autor
; ; ; ;
Abstract / Bemerkung
The correlation between magnetostatic or Neel's coupling and roughness of interfaces in sputtered Cu/Py/V/Py/MnIr/Cu multilayers was investigated with the help of atomic force microscopy and magnetometry. It is shown that the coupling strongly depends on the roughness of seed Cu layer which in turn depends on sputtering power. Roughness levels off after deposition of consecutive layers to about 0.2 nm rms.
Erscheinungsjahr
Zeitschriftentitel
ACTA PHYSICA POLONICA A
Band
105
Zeitschriftennummer
3
Seite
307-313
ISSN
PUB-ID

Zitieren

Urbaniak M, Brückl H, Stobiecki F, Lucinski T, Reiss G. Neel's magnetostatic coupling in sputtered Cu/Py/V/Py/MnIr/Cu multilayers. ACTA PHYSICA POLONICA A. 2004;105(3):307-313.
Urbaniak, M., Brückl, H., Stobiecki, F., Lucinski, T., & Reiss, G. (2004). Neel's magnetostatic coupling in sputtered Cu/Py/V/Py/MnIr/Cu multilayers. ACTA PHYSICA POLONICA A, 105(3), 307-313. doi:10.12693/APhysPolA.105.307
Urbaniak, M., Brückl, H., Stobiecki, F., Lucinski, T., and Reiss, G. (2004). Neel's magnetostatic coupling in sputtered Cu/Py/V/Py/MnIr/Cu multilayers. ACTA PHYSICA POLONICA A 105, 307-313.
Urbaniak, M., et al., 2004. Neel's magnetostatic coupling in sputtered Cu/Py/V/Py/MnIr/Cu multilayers. ACTA PHYSICA POLONICA A, 105(3), p 307-313.
M. Urbaniak, et al., “Neel's magnetostatic coupling in sputtered Cu/Py/V/Py/MnIr/Cu multilayers”, ACTA PHYSICA POLONICA A, vol. 105, 2004, pp. 307-313.
Urbaniak, M., Brückl, H., Stobiecki, F., Lucinski, T., Reiss, G.: Neel's magnetostatic coupling in sputtered Cu/Py/V/Py/MnIr/Cu multilayers. ACTA PHYSICA POLONICA A. 105, 307-313 (2004).
Urbaniak, M, Brückl, Hubert, Stobiecki, F, Lucinski, T, and Reiss, Günter. “Neel's magnetostatic coupling in sputtered Cu/Py/V/Py/MnIr/Cu multilayers”. ACTA PHYSICA POLONICA A 105.3 (2004): 307-313.