Thermal reaction and stability of NiFe/Cu thin films investigated by atom probe tomography

Ene CB, Schmitz G, Kirchheim R, Hütten A (2007)
SURFACE AND INTERFACE ANALYSIS 39(2-3): 227-231.

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NiFe/Cu multilayer stacks of 2 nm single layer thickness were deposited onto needle-shaped W tips by ion beam sputtering and analysed by atom probe tomography (TAP) after appropriate heat treatments. After annealing at 250 degrees C for 30 min, no significant structural or chemical transformation of the initial layer system is detected, although such a heat treatment appreciably reduces the magneto resistivity. A slight decrease of the concentration slope at the interfaces is attributed to a very short-range interdiffusion. Clear grain boundary diffusion is observed after annealing at 400 degrees C for 30 min. Further annealing at 500 degrees C for 20 min and 40 min still preserves the layered structure with a homogeneous solution of Ni inside the Cu layers of up to 25 at.% Ni. Copyright (C) 2007 John Wiley & Sons, Ltd.
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Ene CB, Schmitz G, Kirchheim R, Hütten A. Thermal reaction and stability of NiFe/Cu thin films investigated by atom probe tomography. SURFACE AND INTERFACE ANALYSIS. 2007;39(2-3):227-231.
Ene, C. B., Schmitz, G., Kirchheim, R., & Hütten, A. (2007). Thermal reaction and stability of NiFe/Cu thin films investigated by atom probe tomography. SURFACE AND INTERFACE ANALYSIS, 39(2-3), 227-231. doi:10.1002/sia.2519
Ene, C. B., Schmitz, G., Kirchheim, R., and Hütten, A. (2007). Thermal reaction and stability of NiFe/Cu thin films investigated by atom probe tomography. SURFACE AND INTERFACE ANALYSIS 39, 227-231.
Ene, C.B., et al., 2007. Thermal reaction and stability of NiFe/Cu thin films investigated by atom probe tomography. SURFACE AND INTERFACE ANALYSIS, 39(2-3), p 227-231.
C.B. Ene, et al., “Thermal reaction and stability of NiFe/Cu thin films investigated by atom probe tomography”, SURFACE AND INTERFACE ANALYSIS, vol. 39, 2007, pp. 227-231.
Ene, C.B., Schmitz, G., Kirchheim, R., Hütten, A.: Thermal reaction and stability of NiFe/Cu thin films investigated by atom probe tomography. SURFACE AND INTERFACE ANALYSIS. 39, 227-231 (2007).
Ene, C. B., Schmitz, G., Kirchheim, R., and Hütten, Andreas. “Thermal reaction and stability of NiFe/Cu thin films investigated by atom probe tomography”. SURFACE AND INTERFACE ANALYSIS 39.2-3 (2007): 227-231.
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